مجتمع

High-speed data transfer,Data connectivity,Samtec,SiFly connector,Telemetry,Broadcasting,Fan engagement,Operational efficiency

D-sub connectors are easily recognizable by their distinctive D-shaped metal shield.

AMD Versal AI Edge, AI at the Edge, VE2302 SoM, System-on-Module, Avnet Development Kit, Samtec AcceleRate® HD Connectors, High-Density Interconnects, Edge AI Applications

The AcceleRate® HP cable system provides an excellent mix of density and performance.

Drivers and Trends Stimulating the Intelligent Power Module (IPM) Market Growth

Intel's receipt of the $8.5 billion grant takes a considerable slice of the CHIPS Act's $52.7 billion fund, carrying with it the federal government’s substantial expectations for impact.

Advancements in electric vehicle technology are propelling the automotive industry towards electric mobility.

Harsh Environment Connectors, Standards, Real-World Considerations, Oil and Gas, Military, Industrial Automation, Signal Transmission, Size and Weight, Cost, MIL-STD-83513, IEC 60603-2, API 6A, Mating Cycles, Shielding Requirements, Safety Requirements

SiC Inverter Control Modules, E-mobility, CISSOID, BonChip Electronics, Efficiency, Functional Safety, Time-to-Market

Semiconductor Innovation and Connectivity Solutions

SiC Inverter Control Module: Empowering E-Mobility Innovation

The TLE49SR boasts exceptional accuracy, delivering an angle error of less than 1 degree.

Samtec, Keysight, DesignCon 2024, NovaRay Connector System, High-Speed Interconnect, Signal Integrity, Multi-Domain Testing, Time Domain Reflectometer (TDR)

The new IMU is ASIL-B compliant when used with ST’s certified software library and features a range of embedded digital capabilities, including a machine-learning core (MLC) and programmable finite state machines (FSM) for onboard data processing.

Littelfuse, IX4352NE, Low-Side Gate Driver, SiC MOSFET

Magnachip’s automotive MOSFET and IGBT product families have garnered design wins from a number of major global automakers

In this roundup, we highlight three motor driver solutions for niche yet important automotive systems, from blowers to seat belt pre-tensioners.

Microchip says that the new MXT2952TD 2.0 devices offer “exceptional” noise immunity and can be used with IK10-standard touchscreens featuring anti-glare and other types of protective coatings.

The emergence of the Ambient IoT addresses this challenge by introducing a class of connected devices primarily powered through energy harvesting from ambient sources like radio waves, light, motion, and heat.

This innovative solution simplifies battery management by offering comprehensive status information and functionalities, empowering engineers and system designers.

STMicroelectronics, BonChip Electronics, Wireless Charging, High-Power Applications, Medical Equipment

COSEL, BonChip Electronics, HFA3500TF, 3-Phase Power Supply, AC/DC Enclosed Power Supply, Industrial Equipment

Alpha and Omega Semiconductor, BonChip Electronics, AONG36322, XSPairFET, DC-DC Applications

Nexperia, BonChip Electronics, SiC MOSFET, D2PAK-7, Surface Mount Device (SMD), Electric Vehicle (EV) Charging

Eaton, BonChip Electronics, Bussmann Series Fuses, Electrified Commercial Vehicles, High-Power Fuses

A High-Performance, Feature-Rich LED Driver for Demanding Applications

Board-to-Board Connector, Connector Selection, PCB Design, Samtec, Normal Force, Insertion Depth, Pin Configuration, Centerline, Pitch

STMicroelectronics Unveils New High-Efficiency DC-DC Converters for Streamlined Automotive Designs

Diotec Semiconductor, BonChip Electronics, MD06P115, P-Channel Power MOSFET, Solar Power Bank

Microchip Technology, BonChip Electronics, SAMD21RT, Radiation-Tolerant MCU, Space Exploration, Artemis II,

SiC is a revolutionary material rapidly gaining traction due to its exceptional properties

MIL-DTL-38999 Series III Space Grade, circular connector, space applications, harsh environments, quick mating, robust scoop proof, extended performances, broad range

Qualcomm Snapdragon 7+ Gen 3, mobile processor, CPU performance, GPU performance, on-device AI, generative AI, Wi-Fi 7, HBS multi-link, Snapdragon 8 series, Snapdragon 7 series

The new family of trench Schottky diodes encompasses 28 variants, catering to a wide range of design requirements.

The ZWS-C series delivers rated power outputs of 10W, 15W, 30W, and 50W, making them suitable for various industrial applications.

intel,cpu,computing,desktop processors,Intel Core i9-14900KS

This innovative device functions by capturing the magnetic fields naturally emanating from nearby electrical wires;

Infineon, CoolSiC MOSFET G2, Silicon Carbide (SiC), Power Systems, Energy Conversion, Decarbonization,Photovoltaics, Energy Storage, DC EV Charging, Motor Drives, Industrial Power Supplies

power,TDK-Lambda,recom,dc-dc converters,CUI Inc,Traco Power

The DC-DC converter market is experiencing significant growth,